Method of depositing electrodes and electrolyte on microelectromechanical system electrochemical sensors

ABSTRACT

Embodiments relate generally to systems, devices, and methods for depositing an electrode and an electrolyte on a microelectromechanical system (MEMS) electrochemical sensor. A method may comprise providing a blade on a surface of a substrate; providing a ridge along the perimeter of the substrate; pressing the electrode and the electrolyte onto the blade and the ridge; cutting the electrode into multiple electrodes; positioning the electrolyte to contact the surface, the blade, and the ridge; and positioning the multiple electrodes to contact the surface, the blade, and the ridge.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of European Patent Application No.17199488.2 filed Oct. 31, 2017, the disclosure of which is hereinincorporated by reference in its entirety.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

REFERENCE TO A MICROFICHE APPENDIX

Not applicable.

BACKGROUND

Electrochemical sensors may be utilized to detect various types of gasesincluding oxygen, as well as other types of gases, such as, for example,hydrogen sulfide, chlorine, nitric oxide, carbon monoxide, andhydrocarbons. Electrochemical sensors may be positioned within a housingwhich may include an electrolyte. External electrical connections mayallow the electrochemical sensors to be electrically coupled to externalprocessing circuitry. Typically, the electrochemical sensor assemblyincluding the housing and the electrochemical sensors is relativelylarge. The overall size may contribute to signal degradation between theelectrochemical sensors and the external processing circuitry, and mayalso preclude use in small instruments, such as, for example, mobilephones, wearables, etc. Additionally, large size electrodes and largesize electrolyte volume may increase the cost of the sensor.

SUMMARY

In an embodiment, a method for depositing an electrode and anelectrolyte on a microelectromechanical system (“MEMS”) electrochemicalsensor, the method comprising: providing a blade on a surface of asubstrate; providing a ridge along the perimeter of the substrate,wherein the height of the ridge is greater than the height of the blade,wherein the ridge is positioned to surround the blade, wherein pocketsare positioned along the surface between the blade and the ridge,wherein the ridge is tapered; pressing the electrode and the electrolyteonto the blade and the ridge, wherein the electrolyte is positioned tocontact the top of the electrode; cutting the electrode into multipleelectrodes; positioning the electrolyte within the pockets to contactthe surface, the blade, and the ridge; and positioning the multipleelectrodes within the pockets to contact the surface, the blade, and theridge.

In an embodiment, a MEMS electrochemical sensor may comprise a substratecomprising a surface; a blade configured to cut an electrode intoseparate electrodes; a ridge extending along the perimeter of thesubstrate, wherein the height of the ridge is greater than the height ofthe blade, wherein the ridge is positioned to surround the blade,wherein pockets are positioned along the surface between the blade andthe ridge, wherein the ridge is tapered and configured to cut anelectrolyte.

These and other features will be more clearly understood from thefollowing detailed description taken in conjunction with theaccompanying drawings and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure, referenceis now made to the following brief description, taken in connection withthe accompanying drawings and detailed description, wherein likereference numerals represent like parts.

FIG. 1 illustrates a silicon substrate in accordance with embodiments ofthe disclosure.

FIG. 2 illustrates a silicon substrate with a blade in accordance withembodiments of the disclosure.

FIG. 3 illustrates a silicon substrate with a blade and a ridge inaccordance with embodiments of the disclosure.

FIG. 4 illustrates a cross section of FIG. 3 in accordance withembodiments of the disclosure.

FIG. 5 illustrates a cross section of FIG. 3 and additionally shows anelectrolyte and an electrode in accordance with embodiments of thedisclosure.

FIG. 6 illustrates multiple electrodes positioned on a substrate inaccordance with embodiments of the disclosure.

FIG. 7 illustrates a cross section of FIG. 3 and additionally shows anelectrolyte and electrode in accordance with embodiments of thedisclosure.

FIG. 8 illustrates a top view of an alternative configuration of ablade, a sensing electrode, a counter electrode, a reference electrode,and an optional diagnostic electrode surrounded by a ridge in accordancewith embodiments of the disclosure.

FIG. 9 illustrates an alternative configuration of a blade, a sensingelectrode, and a counter electrode in accordance with embodiments of thedisclosure.

FIG. 10 illustrates a top view of the configuration shown in FIG. 9 inaccordance with embodiments of the disclosure.

DETAILED DESCRIPTION

It should be understood at the outset that although illustrativeimplementations of one or more embodiments are illustrated below, thedisclosed systems and methods may be implemented using any number oftechniques, whether currently known or not yet in existence. Thedisclosure should in no way be limited to the illustrativeimplementations, drawings, and techniques illustrated below, but may bemodified within the scope of the appended claims along with their fullscope of equivalents.

The following brief definition of terms shall apply throughout theapplication:

The term “comprising” means including but not limited to, and should beinterpreted in the manner it is typically used in the patent context;

The phrases “in one embodiment,” “according to one embodiment,” and thelike generally mean that the particular feature, structure, orcharacteristic following the phrase may be included in at least oneembodiment of the present invention, and may be included in more thanone embodiment of the present invention (importantly, such phrases donot necessarily refer to the same embodiment);

If the specification describes something as “exemplary” or an “example,”it should be understood that refers to a non-exclusive example;

The terms “about” or “approximately” or the like, when used with anumber, may mean that specific number, or alternatively, a range inproximity to the specific number, as understood by persons of skill inthe art field; and

If the specification states a component or feature “may,” “can,”“could,” “should,” “would,” “preferably,” “possibly,” “typically,”“optionally,” “for example,” “often,” or “might” (or other suchlanguage) be included or have a characteristic, that particularcomponent or feature is not required to be included or to have thecharacteristic. Such component or feature may be optionally included insome embodiments, or it may be excluded.

MEMS semiconductor manufacturing techniques enable very small, low costsensors to be fabricated. However, the gas diffusion electrodestraditionally used for electrochemical gas sensors are difficult topattern at the sort of scales needed for a small MEMS device (e.g., 100μm and less). Although other types of electrode and manufacturingtechniques can be used, there are benefits to being able to useconventional gas diffusion electrodes.

Systems, methods, and devices of the disclosure may allow a conventionalstack of electrodes and a solid electrolyte to be deposited onto a MEMSsubstrate, without needing a separate means of patterning or cutting theelectrode/electrolyte stack. This greatly simplifies manufacturing andreduces costs. Compared to conventional deposition techniques such asthick film printing, systems, methods, and devices of the disclosureallow the electrode/electrolyte stack to be prepared as an un-patternedsheet which is deposited directly onto the silicon tile or wafer in asingle step. The solid polymer electrolyte is precast as a large sheetwith a gas diffusion electrode deposited on one side. This may beachieved by either pre-fabricating the electrode and electrolyte andpressing them together, or by casting the electrolyte directly onto theelectrode, or by printing the electrode directly onto the pre-castelectrolyte. The silicon devices have raised cutting features (e.g., aridge and a blade), which cut through the electrode but not completelythrough the electrolyte when the parts are pressed together. Thisseparates out the gas diffusion electrode into separate regions whichthen make contact to suitable connections underneath each electroderegion on the surface of the substrate, to create electrodes such as thesensing, counter, and reference electrodes. Optionally, taller featuresaround the perimeter of each device cut right through the electrolytelayer, thereby punching out the electrolyte for each device. Theelectrolyte can be deposited onto individual diced substrates, orpreferably deposited onto a whole wafer in a single step. The cuttingfeatures may be produced by etching the substrate or may be a separatecomponent such as a glass or separate silicon structure bonded to theflat substrate.

FIG. 1 is a schematic illustration of a silicon substrate 100 with a topsurface 102. Substrate 100 may be of any suitable shape, such as, forexample, a rectangular prism (as shown), cube, etc.

FIG. 2 is a schematic illustration of a blade 104 comprising silicondioxide (SiO₂). Blade 104 may extend outward from top surface 102. Insome embodiments, blade 104 may be a glass or separate siliconstructure, wherein proximal end 108 of blade 104 may be bonded (e.g.,adhesive, welds) to top surface 102. In other embodiments, blade 104 maybe produced/formed by etching substrate 100. Blade 104 may be taperedfrom proximal end 108 to distal end 106. The tapering provides blade 104with a sharp edge to cut through an electrode (e.g., electrode 126 shownon FIG. 5) and an electrolyte (e.g., electrolyte 124 shown on FIG. 5).In certain embodiments, blade 104 may resemble a cross with each end(four ends: end 105 a, end 105 b, end 105 c, end 105 d) of the crosscontacting perimeter 111, as shown. Blade 104 may extend along topsurface 102 to perimeter 111.

FIG. 3 illustrates ridge 110 extending along perimeter 111 (shown onFIG. 2) of top surface 102. Ridge 110 may comprise SiO₂. Ridge 110 mayextend above blade 104 (e.g., extend away from top surface 102), asshown. That is, the height of ridge 110 may be greater than the heightof blade 104. Ridge 110 may be a glass or separate silicon structurebonded against perimeter 111 of top surface 102 (e.g., as shown on FIG.4, proximal end 120 of ridge 110 may be bonded to perimeter 111). Inother embodiments, ridge 110 may be produced by etching substrate 100.Ridge 110 may comprise SiO₂. The height of ridge 110 may be the same asthe thickness of the electrolyte (e.g., electrolyte 124 shown on FIG. 5)combined with the electrode (e.g., electrode 126 shown on FIG. 5). Thatis, the top surface of the electrolyte (e.g., electrolyte 124 shown onFIG. 5) will be flush (i.e., a continuous plane) with ridge 110 when theelectrolyte and the electrode (e.g., electrode 126 shown on FIG. 5) arepressed as a stack onto ridge 110 and blade 104. In some embodiments,the height of ridge 110 may be slightly taller than the combinedthickness of the electrolyte with the electrode (e.g., if theelectrolyte is supported by a slightly compressible material). As notedabove, the solid polymer electrolyte (e.g., electrolyte 124 shown onFIG. 5) may be pre-cast as a large sheet with a gas diffusion electrode(e.g., electrode 126 shown on FIG. 5) deposited on one side. This may beachieved by either pre-fabricating the electrode and the electrolyte,and pressing them together, or by casting the electrolyte directly ontothe electrode, or by printing the electrode directly onto the pre-castelectrolyte. Pockets 112, 114, 116, and 118 may be located along surface102 between blade 104 and ridge 110. Ridge 110 may be configured to cutthe electrolyte and the electrode as the electrolyte and the electrodeare pressed upon ridge 110 and blade 104. As the electrode and theelectrolyte are pressed onto ridge 110 and blade 104, the cut portionsof the electrode and electrolyte may slide against blade 104 and ridge110 and into pockets 112, 114, 116, and 118, thereby contacting topsurface 102, blade 104, and ridge 110. That is, the electrolyte andelectrode may be fitted/positioned (e.g., via pressing) within pockets112, 114, 116, and 118.

As shown on FIG. 4 (a cross section of FIG. 3), ridge 110 may be taperedfrom proximal end 120 to distal end 122 to provide a sharp edge forcutting through the electrode (e.g., electrode 126 shown on FIG. 5) andthe electrolyte (e.g., electrolyte 124 shown on FIG. 5).

FIG. 5 (cross section of FIG. 3 and additionally shows electrolyte 124and electrode 126) illustrates electrolyte 124 positioned aboveelectrode 126, thereby forming a stack, wherein electrolyte 124 is incontact with electrode 126, as described above. Electrolyte 124 andelectrode 126 may be pressed upon blade 104 and ridge 110. As shown,ridge 110 and blade 104 may cut electrode 126 and electrolyte 124 aselectrode 126 and electrolyte 124 are pressed onto blade 104 and ridge110 and into pockets 112, 114 (shown on FIG. 3), 116 (shown on FIG. 3),and 118.

As shown on FIG. 6, electrode 126, due to the pressing/cutting, asdescribed above, may be cut into multiple electrodes: for example,working electrode 128 (WE), reference electrode 130 (RE), diagnosticelectrode 132 (DE), and counter electrode 134 (CE). As shown, electrode126 has been completely cut into separate electrodes due to the pressingof it against blade 104 and ridge 110. Ridge 110 is not shown on FIG. 6in order to provide a clear view of working electrode 128, referenceelectrode 130, diagnostic electrode 132, and counter electrode 134.However, as shown on FIG. 3, ridge 110 extends along perimeter 111.

FIG. 7 (cross section of FIG. 3 and additionally shows electrolyte 124,working electrode 128 and reference electrode 130 (i.e. electrode 126after it is cut)) illustrates electrolyte 124, working electrode 128 andreference electrode 130 positioned on substrate 100 (e.g., withinpockets 112 and 118, as shown on FIGS. 3 and 5) after thepressing/cutting, as described above. As shown, blade 104 may partiallycut into electrolyte 124 and may completely cut electrode 126 (shown inFIG. 5) into separate electrodes (e.g. working electrode 128 andreference electrode 130), as discussed above.

FIG. 8 illustrates a top view of an alternative configuration of a blade(e.g., blade 140), a sensing electrode 133, a counter electrode 134, areference electrode 136, and an optional diagnostic electrode 138surrounded by ridge 110 (as described above). Blade 140 may includeportion 141, portion 142, and portion 143. Portion 141 may extend alonga horizontal axis (x) of the top surface 102 of substrate 100 (shown onFIG. 1), thereby contacting ridge 110 at two points (e.g., point 146 andpoint 148). Point 146 and point 148 may be on opposite sides ofsubstrate 100 (shown on FIG. 1). Portions 142 and 143 may extendperpendicularly from the horizontal axis (x) and along a vertical axis(y), as shown. Portion 142 may contact ridge 110 at one point (e.g.,point 150). Portion 143 may contact ridge 110 at one point (e.g., point152). Point 150 and point 152 may be on opposite sides of substrate 100(shown on FIG. 1). The blade, ridge, electrodes and/or electrolyte maybe deposited onto a substrate as described above.

FIG. 9 illustrates an alternative configuration of a blade (e.g., blade154), sensing electrode 156, and counter electrode 158. Blade 154,sensing electrode 156, and counter electrode 158 may each be of a zigzag shape. As shown, a single electrode was pressed/cut (as describedabove) onto blade 154 and a ridge (e.g., ridge 110, shown on FIG. 3)thereby creating separate electrodes. This zig zag configuration ofblade 154, sensing electrode 156, and counter electrode 158 may allow alower impedance between the electrodes when compared to a blade andelectrodes that are not in this zig zag configuration. The blade, ridge,electrodes and/or electrolyte may be deposited onto a substrate asdescribed above.

FIG. 10 illustrates a top view of the configuration shown in FIG. 9. Asshown, ridge 160 (e.g., similar to ridge 110 described above) maycompletely surround blade 154, sensing electrode 156, and counterelectrode 158. Blade 154 may contact ridge 160 at points (e.g., points162, 164) that may be on opposite sides of the substrate (e.g.,substrate 100, shown on FIG. 1).

Having described various systems and methods, various embodiments caninclude, but are not limited to:

In a first embodiment, a method for depositing an electrode and anelectrolyte on a MEMS electrochemical sensor, the method comprising:providing a blade on a surface of a substrate; providing a ridge alongthe perimeter of the substrate, wherein the height of the ridge isgreater than the height of the blade, wherein the ridge is positioned tosurround the blade, wherein pockets are positioned along the surfacebetween the blade and the ridge, wherein the ridge is tapered; pressingthe electrode and the electrolyte onto the blade and the ridge, whereinthe electrolyte is positioned to contact the top of the electrode;cutting the electrode into multiple electrodes; positioning theelectrolyte within the pockets to contact the surface, the blade, andthe ridge; and positioning the multiple electrodes within the pockets tocontact the surface, the blade, and the ridge.

A second embodiment may include the method of the first embodiment,further comprising partially cutting the electrolyte with the blade.

A third embodiment may include the method of the first or secondembodiments, wherein cutting the electrode comprises completely cuttingthe electrode into multiple electrodes.

A fourth embodiment may include the method of any one of the precedingembodiments, wherein cutting the electrode comprises cutting theelectrode with the blade.

A fifth embodiment may include the method of any one of the precedingembodiments, wherein cutting the electrolyte comprises cutting theelectrolyte with the ridge.

A sixth embodiment may include the method of any one of the precedingembodiments, wherein positioning the multiple electrodes comprisessliding the multiple electrodes against the blade and the ridge into thepockets.

A seventh embodiment may include the method of any one of the precedingembodiments, wherein providing the blade comprises etching the substrateto form the blade.

An eighth embodiment may include the method of any one of the precedingembodiments, wherein providing the blade comprises bonding a glass orseparate silicon structure to the surface.

A ninth embodiment may include the method of any one of the precedingembodiments, wherein providing the ridge comprises etching the substrateto form the ridge.

A tenth embodiment may include the method of any one of the precedingembodiments, wherein providing the ridge comprises bonding a glass orseparate silicon structure to the surface.

In an eleventh embodiment, a MEMS electrochemical sensor may comprise asubstrate comprising a surface; a blade configured to cut an electrodeinto separate electrodes; a ridge extending along the perimeter of thesubstrate, wherein the height of the ridge is greater than the height ofthe blade, wherein the ridge is positioned to surround the blade,wherein pockets are positioned along the surface between the blade andthe ridge, wherein the ridge is tapered and configured to cut anelectrolyte.

A twelfth embodiment may include the MEMS electrochemical sensor of theeleventh embodiment, further comprising a sensing electrode, a counterelectrode, and a reference electrode.

A thirteenth embodiment may include the MEMS electrochemical sensor ofthe eleventh or twelfth embodiments, wherein each of the sensingelectrode, the counter electrode, and the reference electrode ispositioned within a pocket.

A fourteenth embodiment may include the MEMS electrochemical sensor ofany one of the eleventh through thirteenth embodiments, furthercomprising a diagnostic electrode positioned in a pocket.

A fifteenth embodiment may include the MEMS electrochemical sensor ofany one of the eleventh through fourteenth embodiments, furthercomprising a sensing electrode and a counter electrode, wherein thesensing electrode, the counter electrode, and the blade each include azig zag shape, wherein the zig zag shape is configured to lowerimpedance between the sensing electrode and the counter electrode.

In a sixteenth embodiment, a method for depositing an electrode and anelectrolyte on a microelectromechanical system (MEMS) electrochemicalsensor, the method comprising: providing a ridge along the perimeter ofa surface of a substrate; pressing the electrode and the electrolyteonto the ridge, wherein the electrolyte is positioned to contact the topof the electrode; and cutting the electrode into multiple electrodes.

A seventeenth embodiment may the method of the sixteenth embodiment,further comprising providing a blade on the surface of the substrate,wherein the height of the ridge is greater than the height of the blade,wherein the ridge is positioned to surround the blade, wherein pocketsare positioned along the surface between the blade and the ridge,wherein the ridge is tapered and configured to cut the electrolyte.

In an eighteenth embodiment, a method for depositing an electrode and anelectrolyte on a microelectromechanical system (MEMS) electrochemicalsensor, the method comprising: providing a blade on a surface of asubstrate; pressing the electrode and the electrolyte onto the blade,wherein the electrolyte is positioned to contact the top of theelectrode; and cutting the electrode into multiple electrodes.

A nineteenth embodiment may include the method of the eighteenthembodiment, further comprising providing a ridge along the perimeter ofthe surface of the substrate, wherein the height of the ridge is greaterthan the height of the blade, wherein the ridge is positioned tosurround the blade, wherein pockets are positioned along the surfacebetween the blade and the ridge, wherein the ridge is tapered andconfigured to cut the electrolyte.

In a twentieth embodiment, a microelectromechanical system (MEMS)electrochemical sensor comprises a substrate comprising a surface; and ablade configured to cut an electrode into separate electrodes.

A twenty-first embodiment, may include the MEMS electrochemical sensorof the twentieth embodiment, further comprising a ridge extending alongthe perimeter of the surface of the substrate, wherein the height of theridge is greater than the height of the blade, wherein the ridge ispositioned to surround the blade, wherein pockets are positioned alongthe surface between the blade and the ridge, wherein the ridge istapered and configured to cut an electrolyte.

In a twenty-second embodiment, a microelectromechanical system (MEMS)electrochemical sensor comprises a substrate comprising a surface; aridge extending along the perimeter of the surface of the substrate,wherein the ridge is tapered and configured to cut an electrolyte.

A twenty-third embodiment may include the MEMS electrochemical sensor ofthe twenty-second embodiment, further comprising a blade configured tocut an electrode into separate electrodes, wherein the height of theridge is greater than the height of the blade, wherein the ridge ispositioned to surround the blade, wherein pockets are positioned alongthe surface between the blade and the ridge.

While various embodiments in accordance with the principles disclosedherein have been shown and described above, modifications thereof may bemade by one skilled in the art without departing from the spirit and theteachings of the disclosure. The embodiments described herein arerepresentative only and are not intended to be limiting. Manyvariations, combinations, and modifications are possible and are withinthe scope of the disclosure. Alternative embodiments that result fromcombining, integrating, and/or omitting features of the embodiment(s)are also within the scope of the disclosure. Accordingly, the scope ofprotection is not limited by the description set out above, but isdefined by the claims which follow, that scope including all equivalentsof the subject matter of the claims. Each and every claim isincorporated as further disclosure into the specification and the claimsare embodiment(s) of the present invention(s). Furthermore, anyadvantages and features described above may relate to specificembodiments, but shall not limit the application of such issued claimsto processes and structures accomplishing any or all of the aboveadvantages or having any or all of the above features.

Additionally, the section headings used herein are provided forconsistency with the suggestions under 37 C.F.R. 1.77 or to otherwiseprovide organizational cues. These headings shall not limit orcharacterize the invention(s) set out in any claims that may issue fromthis disclosure. Specifically and by way of example, although theheadings might refer to a “Field,” the claims should not be limited bythe language chosen under this heading to describe the so-called field.Further, a description of a technology in the “Background” is not to beconstrued as an admission that certain technology is prior art to anyinvention(s) in this disclosure. Neither is the “Summary” to beconsidered as a limiting characterization of the invention(s) set forthin issued claims. Furthermore, any reference in this disclosure to“invention” in the singular should not be used to argue that there isonly a single point of novelty in this disclosure. Multiple inventionsmay be set forth according to the limitations of the multiple claimsissuing from this disclosure, and such claims accordingly define theinvention(s), and their equivalents, that are protected thereby. In allinstances, the scope of the claims shall be considered on their ownmerits in light of this disclosure, but should not be constrained by theheadings set forth herein.

Use of broader terms such as “comprises,” “includes,” and “having”should be understood to provide support for narrower terms such as“consisting of,” “consisting essentially of,” and “comprisedsubstantially of” Use of the terms “optionally,” “may,” “might,”“possibly,” and the like with respect to any element of an embodimentmeans that the element is not required, or alternatively, the element isrequired, both alternatives being within the scope of the embodiment(s).Also, references to examples are merely provided for illustrativepurposes, and are not intended to be exclusive.

While several embodiments have been provided in the present disclosure,it should be understood that the disclosed systems and methods may beembodied in many other specific forms without departing from the spiritor scope of the present disclosure. The present examples are to beconsidered as illustrative and not restrictive, and the intention is notto be limited to the details given herein. For example, the variouselements or components may be combined or integrated in another systemor certain features may be omitted or not implemented.

Also, techniques, systems, subsystems, and methods described andillustrated in the various embodiments as discrete or separate may becombined or integrated with other systems, modules, techniques, ormethods without departing from the scope of the present disclosure.Other items shown or discussed as directly coupled or communicating witheach other may be indirectly coupled or communicating through someinterface, device, or intermediate component, whether electrically,mechanically, or otherwise. Other examples of changes, substitutions,and alterations are ascertainable by one skilled in the art and could bemade without departing from the spirit and scope disclosed herein.

What is claimed is:
 1. A method for depositing an electrode (126) and anelectrolyte (124) on a microelectromechanical system (MEMS)electrochemical sensor, the method comprising: providing a ridge (110)along the perimeter (111) of a surface (102) of a substrate (100);pressing the electrode (126) and the electrolyte (124) onto the ridge(110), wherein the electrolyte (124) is positioned to contact the top ofthe electrode (126); and cutting the electrode (126) into multipleelectrodes (132, 134, 136, 138).
 2. The method of claim 1, furthercomprising providing a blade (104) on the surface (102) of the substrate(100), wherein the height of the ridge (110) is greater than the heightof the blade (104), wherein the ridge (110) is positioned to surroundthe blade (104), wherein pockets (112, 114, 116, 118) are positionedalong the surface (102) between the blade (104) and the ridge (110),wherein the ridge (110) is tapered and configured to cut the electrolyte(124).
 3. The method of claim 2, further comprising: pressing theelectrode (126) and the electrolyte (124) onto the blade (104);partially cutting the electrolyte (124) with the blade (104); andpositioning the multiple electrodes within the pockets (112, 114, 116,118) to contact the surface (102), the blade (104), and the ridge (110).4. The method of claim 3, positioning the electrolyte (124) within thepockets (112, 114, 116, 118) to contact the surface (102), the blade(104), and the ridge (110).
 5. A method for depositing an electrode(126) and an electrolyte (124) on a microelectromechanical system (MEMS)electrochemical sensor, the method comprising: providing a blade (104)on a surface (102) of a substrate (100); pressing the electrode (126)and the electrolyte (124) onto the blade (104), wherein the electrolyte(124) is positioned to contact the top of the electrode (126); andcutting the electrode (126) into multiple electrodes (132, 134, 136,138).
 6. The method of claim 5, further comprising providing a ridge(110) along the perimeter (111) of the surface (102) of the substrate(100), wherein the height of the ridge (110) is greater than the heightof the blade (104), wherein the ridge (110) is positioned to surroundthe blade (104), wherein pockets (112, 114, 116, 118) are positionedalong the surface (102) between the blade (104) and the ridge (110),wherein the ridge (110) is tapered and configured to cut the electrolyte(124).
 7. The method of claim 6, further comprising: pressing theelectrode (126) and the electrolyte (124) onto the ridge (110);partially cutting the electrolyte (124) with the blade (104); andpositioning the multiple electrodes within the pockets (112, 114, 116,118) to contact the surface (102), the blade (104), and the ridge (110).8. A microelectromechanical system (MEMS) electrochemical sensorcomprising: a substrate (100) comprising a surface (102); and a blade(104) configured to cut an electrode (126) into separate electrodes(132, 134, 136, 138).
 9. The MEMS electrochemical sensor of claim 8,further comprising a ridge (110) extending along the perimeter (111) ofthe surface (102) of the substrate (100), wherein the height of theridge (110) is greater than the height of the blade (104), wherein theridge (110) is positioned to surround the blade (104), wherein pockets(112, 114, 116, 118) are positioned along the surface (102) between theblade (104) and the ridge (110), wherein the ridge (110) is tapered andconfigured to cut an electrolyte (124).
 10. The MEMS electrochemicalsensor of claim 9, further comprising a sensing electrode (133), acounter electrode (134), and a reference electrode (136).
 11. Amicroelectromechanical system (MEMS) electrochemical sensor comprising:a substrate (100) comprising a surface (102); a ridge (110) extendingalong the perimeter (111) of the surface (102) of the substrate (100),wherein the ridge (110) is tapered and configured to cut an electrolyte(124).
 12. The MEMS electrochemical sensor of claim 11, furthercomprising a blade (104) configured to cut an electrode (126) intoseparate electrodes (132, 134, 136, 138), wherein the height of theridge (110) is greater than the height of the blade (104), wherein theridge (110) is positioned to surround the blade (104), wherein pockets(112, 114, 116, 118) are positioned along the surface (102) between theblade (104) and the ridge (110).
 13. The MEMS electrochemical sensor ofclaim 12, further comprising a sensing electrode (133), a counterelectrode (134), and a reference electrode (136), wherein each of thesensing electrode (133), the counter electrode (134), and the referenceelectrode (136) is positioned within a pocket (112, 116, 118).
 14. TheMEMS electrochemical sensor of claim 13, further comprising a diagnosticelectrode (138) positioned in a pocket (114).
 15. The MEMSelectrochemical sensor of claim 12, further comprising a sensingelectrode (156) and a counter electrode (158), wherein the sensingelectrode (156), the counter electrode (158), and the blade (154) eachinclude a zig zag shape, wherein the zig zag shape is configured tolower impedance between the sensing electrode (156) and the counterelectrode (158).